Part Number Decoder | Micron Memory

The package code consists of two letters indicating the physical casing, physical dimensions, material composition (lead-free vs. leaded), and ball grid array (BGA) layout. Because these change frequently across generations, consulting Micron's active packaging catalog is essential. Common examples include: : 78-ball FBGA (DDR4) VA : 96-ball FBGA (DDR4) HC : 78-ball FBGA (DDR5) 5. Speed Grades and Cycle Times

Standard FBGA package optimized for desktop/server applications

: Useful for finding compatible replacements for DRAM and LPDRAM components. DRAM Component Decoding (Structure) micron memory part number decoder

It is usually the second line of text on the chip, often starting with "D9", "C9", or "Z9".

: Shows the total capacity and data bus width. The package code consists of two letters indicating

MT 40A 1G8 SA -062E :E ── ─── ─── ── ──── ─ │ │ │ │ │ │ │ │ │ │ │ └── Die Revision (E) │ │ │ │ └────── Speed Grade / Cycle Time (-062E = DDR4-3200) │ │ │ └─────────── Package Code (SA = 78-ball FBGA) │ │ └──────────────── Density & Configuration (1G8 = 1 Gig x 8) │ └───────────────────── Product Family / Voltage (40A = 1.2V DDR4) └───────────────────────── Micron Technology Designator 1. Brand Designator

Micron's NAND Flash and Solid-State Drives use a similar alphanumeric matrix, though the variables focus heavily on storage cells and interface protocols. [MT] [FD] [DA] [K] [1T0] [TBD] - [1A] [1] [2] [AZ] [YY] Common examples include: : 78-ball FBGA (DDR4) VA

: The primary tool for translating 5-digit chip markings (e.g., "D9VPP") into full Micron Part Numbers (MPN) .