Eyeq4 Datasheet Extra Quality -
Integration with Mobileye Road Experience Management (REM) for crowdsourced high-definition mapping.
28nm FinFET (Taiwan Semiconductor Manufacturing Company - TSMC) Typical: 3W – 5W (highly efficient for passive cooling) CPU Architecture 4x MIPS I6500 (Multi-threaded, multi-core cluster) Memory Support Dual-channel LPDDR4 / LPDDR4X (up to 4266 MT/s) Video Input Up to 8 concurrent camera streams via MIPI CSI-2 Display Output
3x CAN ports (>1Mbps), 3x UART, 3x I2C, and 4x SPI interfaces. Documentation and Resources Mobileye EyeQ4 Vision Processor Family - Yole Group
The full datasheet contains additional part numbers for ISO 26262 ASIL-D certified variants. eyeq4 datasheet
Two PMA cores acting as a Coarse-Grained Reconfigurable Array (CGRA) dataflow machine, accelerating dense computer vision and deep learning data pipelines.
: Historically, Mobileye chips have been more "black box" systems, though later generations (like EyeQ5) began moving toward more open software platforms. performance against the newer
: Already integrated into over 160 car models from major OEMs like GM, Nissan, and Honda. Generationally Older : While powerful, it has since been surpassed by the EyeQ Ultra Two PMA cores acting as a Coarse-Grained Reconfigurable
Inside the EyeQ4: The "Supercomputer" Driving Your Next Car Mobileye EyeQ4
The EyeQ4, combined with ZF’s mid-range radar, is used to optimize lateral and longitudinal control in Toyota vehicles. 5. Conclusion: The Legacy of EyeQ4
The EyeQ4 operates on a very efficient 3W envelope, ideal for automotive requirements. Generationally Older : While powerful, it has since
6 Vector Microcode Processors (VMP), 2 Multithreaded Processing Clusters (MPC), 2 Programmable Macro Arrays (PMA) Up to 8 cameras simultaneously at 36 fps Safety Standard ISO 26262 compliant; ASIL-B(D) level Package Flip-Chip FBGA 784-pin (22.5 x 22.5 x 1.7mm) Key Capabilities The Evolution of EyeQ - Mobileye
22.5 mm x 22.5 mm x 1.7 mm Flip-Chip FBGA (784 pins, 0.8mm pitch) 2. Semiconductor Technology & Package Specifications 28nm FD-SOI Process